Lab #9 - CertExams Labs 1.4,5,6,7&8
Objectives:
1. To become familiar with different CPU cooling systems, motherboard form factors and connector types.
Procedure:
a. Complete virtual labs 1.4, 1.5, 1.6, 1.7 and 1.8 from CertExams A+ Lab Simulator, submit the images and be prepared to answer questions about the procedures.
b. The questions that will come from these labs are:
1.Which type of cooling system is not recommended for modern CPU's?
2. What is always applied to the CPU and heatsink to assist thermal conductivity?
3. Lab 1.6 showed a variety of USB connectors what is the new one that we will be used in Apple products too. What is it called?
4. From Lab 1.7 on the ITX motherboard, what does TPM stand for?
5. From Lab 1.7 on the ITX motherboard, it shows USB 2.0 and 3.0 ports. What is the newer faster version of USB?
c. Take all these images and answer and put into a document and upload it to Lab #9 assignment. Each image and each question is worth 5 points for a total of 50pts. for the lab submission.